MODULARITY: aosd•13 > Calls: Industry Track

Call for Industry Papers

Overview

Modularity is the foundation of large-scale modern software development. As software becomes larger and more complex, traditional modularity techniques are no longer sufficient to create and maintain software systems. The International Conference on Aspect-Oriented Development (AOSD) is the premier conference on software modularity. The AOSD 2013 industry track is calling on software professionals to submit papers on modularity describing advanced solutions, state of the art practices, problem descriptions, experiences, and system/tool developments.

Topics

Domains of interest include, but are not limited to cloud computing, middleware, desktop applications, financial, communications, automotive, and languages/tools. Each domain has its own technologies, development style, and business context. More specifically, AOSD 2013 is seeking submissions that address questions such as the following:

  • How are traditional forms of modularity insufficient for solving complex technical problems?
  • What novel techniques of modularity are being used?
  • How is modularity being used at different stages of the software development process: requirements, design, architecture, modelling, programming, testing?
  • Are techniques such as aspect-orientation, domain-specific languages, software services, generative programming, and meta-programming useful for creating well-modularized systems?
  • Dependency management and provisioning tools such as p2, maven, and gradle help create large software from reusable components, but are they sufficient?
  • Finally, what are the complications of producing and consuming modular software in the open source community?

Important Dates

AOSD 2013 is deeply committed to eliciting works of the highest caliber. To this aim, two separate paper submission deadlines and review stages are offered. A paper accepted in either round will be published in the web-proceedings and presented at the conference. Promising papers submitted in an early round that are not accepted may be invited to be revised and resubmitted for review in a later round. Authors of such invited resubmissions are asked to also submit a letter explaining the revisions made to the paper to address the reviewer's concerns. While there is no guarantee that an invited resubmission paper will be accepted, this procedure, similar to major revisions requested by journals, is designed to help authors of promising work get their papers into the conference.

  • Round 1: Submission: July 23rd / Notification: September 10th
  • Round 2: Submission: October 8th / Notification: December 10th

(all deadlines are in 2012, 23:59:59 Pago Pago, American Samoa, time)

How to Submit

Submissions to the AOSD 2013 industry track will be accepted at http://aosd.net/2013/industry_track/submissions/. Submission should be no longer than 10,000 characters and in markdown format.

Any images, figures, or graphs should be hosted at a third party image sharing site such as Imgur and linked to from the submitted document. The industry track organizing committee may migrate these images to AOSD.net servers for the camera-ready copy.

Review process

Each submission will be reviewed by the AOSD 2013 industry program committee. Evaluation is based mainly on the usefulness to the AOSD community, i.e., each submission should describe its modularity issue (problem, solution, practice, experience and/or system/tool development) along with characteristics of its industrial domain Explicit discussion on the issue is also required, such as analysis of the problem, benefit/ drawbacks of the solutions, lessons learned from the experience. Importance of the issues, deepness of their discussions and understandability (technical soundness, clarity and organization) will be evaluated. The committee may contact authors as a part of review process.

Program Committee — Industry Track

  • Uwe Hohenstein, Siemens Germany
  • Thomas Cottenier, UniqueSoft, USA
  • Klaus Havelund, Jet Propulsion Laboratory/NASA, USA
  • Takashi Ishio, Osaka University, Japan
  • Natsuko Noda, NEC Corp. Japan
  • Hideaki Shinomi, Hitachi Ltd. Japan